凱旋達(dá)塑膠材料有限公司

1) the acyl chloride method

　　(2）异氰酸酯法
(2) the isocyanate method

　　(3）直接聚合法
(3) direct polymerization

　　(4）亚胺二碳酸法
(4) imine two carbonate method

　　三酸酐的酰氯与芳族二胺反应制备聚酰胺-酰亚胺是一种重要的方法，其工艺如下：
Three benzene anhydride chloride with two amine was prepared by the reaction of aromatic polyamide imide is an important method, the process is as follows:

　　反应釜内加入定量的4，4′-二氨基联醚、二甲基、二，启动搅拌。待物料全部溶解后，再加入1，2，4-偏三甲酸酰氯。反应温度控制在25～35℃。当粘度达大值时，用二甲基和二稀释。然后，用环氧乙烷中和发应副产出，可得到可溶性的聚酰胺-酰胺酸预聚体。若将此预聚体在高温下脱水环化，即可制得不熔不溶的聚酰胺-酰亚胺。
The reaction kettle with quantitative 4, 4 '- two amino diphenyl ether, two dimethyl acetamide, xylene, start stirring. The material is completely dissolved, add 1, 2, three 4- trimellitic acid chloride. The reaction temperature is controlled at 25 ～ 35 ℃. When the viscosity of the maximum value, diluted with two methyl acetamide and xylene. Then, by epoxy ethane and hair should be pair of output can be obtained hydrochloric acid, soluble polyamide amide acid prepolymer. If this prepolymer dehydration at high temperature, cyclization, acyl polyamide can be prepared insoluble and infusible imine.

3、理化性能
3, physical and chemical properties

　　聚酰胺-酰亚胺的强度是当今上任何工业未增强塑料不可比拟的，其拉伸强度超过172MPa，在1.8MPa负荷下热变形温度为274℃。
Polyamide imide strength is one of the world's industrial not reinforced plastic incomparable, the tensile strength is more than 172MPa, in the 1.8MPa load and thermal deformation temperature of 274 ℃.

　　Torlon聚合物在制造后还可能进行固态聚合物，通过后固化增加分子量提供更优良的性能。后固化在260℃下发生，固化所需的时间和温度主要取决于零件的厚度和形状。
Torlon polymer after fabrication may also be solid polymer, the molecular weight increased after curing provides better performance. After curing at 260 ℃, temperature and curing time required depends mainly on the part thickness and shape.

　　它可在220℃下长期使用，300℃下不失重，450℃左右开始分解。其粘接性、柔韧性及耐碱性更佳，可与环氧树脂互混交联固化，耐磨性良好。
It can be used for a long time at 220 ℃, 300 ℃ not weightless, 450 ℃ begins to decompose. The adhesion, flexibility and resistance to alkali is better, with epoxy resin mixed curing, good wear resistance.

4、加工成型
4, processing

　　（1）模塑
(1) molding

　　注射成型前应将料进行预干燥。干燥条件为150℃、8小时。料筒温度上限为360℃，模加工温度为200℃。注射压力尽量大，关闭增压泵后降至保压14～28MPa，背压为0.3MPa。后固化时间，在170～260℃条件下，约三天左右。
Before injection molding material should be pre drying. Drying temperature is 150 ℃, 8 hours. The upper barrel temperature is 360 ℃, die temperature was 200 ℃. The injection pressure is as large as possible, close the booster pump to the pressure of 14 ~ 28MPa, back pressure is 0.3MPa. After the curing time, at 170 ~ 260 ℃, about three days.

　　(2）薄膜
(2) thin film

　　聚酰胺-酰亚胺薄膜采用连续浸渍法制备。用400mm宽、0.05mm厚的铝箔作连续载体。浸有预聚体溶液的铝箔进入立式烘炉，于190℃下烘干，以除去溶剂。然后，于200～210℃下处理2～4小时，使预聚体膜脱水环化。待冷却后，将薄膜由铝箔上剥下即可。
Polyamide imide films by continuous impregnation. Using 400mm wide, 0.05mm thick aluminum foil as a continuous carrier. Dip a prepolymer solution of aluminum foil into the vertical oven, drying at 190 ℃, to remove the solvent. Then, in the 200 ~ 210 ℃ for 2 to 4 hours, the prepolymer membrane dehydration cyclization. After cooling, the film is made of aluminum foil stripping.

　　
5、应用领域
5, application

　　聚酰胺-酰亚胺具有优良的机械性能，本色料拉伸强度为230MPa。模制塑料主要用于齿轮、辊子、轴承和复印机分离爪等。它具有良好的耐烧蚀性能和高温、高频下的电磁性，可作飞行器的烧蚀材料、透磁材料和结构材料。它对金属和其它材料有很好的粘接性能，适用作漆包线漆、浸渍漆、薄膜、层压板材、涂层和粘合剂。例如：用它制作的漆包线已用于H级深水潜水电机上；层压板用于印刷线路板和插座；薄膜作绝缘包扎材料。
Polyamide imide with excellent mechanical properties, color material tensile strength of 190MPa. The molded plastic gear is mainly used, roller, bearing and copier separation claw. It has good resistance to electromagnetic ablation resistance and high temperature, high frequency, can be used as a vehicle of ablative material, magnetic material and structural material. It has good bonding properties of metals and other materials, suitable for enameled wire paint, varnish, films, laminates, coatings and adhesives. For example: H has been used for deepwater submersible motor with its production of enameled wire; laminates for printed circuit board and a socket; thin film is used as insulation material.

　　6、开发动向
6, development trend

　　取酰胺-酰亚胺与聚均四甲酰亚胺比较，有较低的软化点和热变形温度，有较高的吸水率、相对介电常数和介质损耗角正切性能。今后发展方向是增强改性，同其它塑料进行合金化，以改善其不利的性能，满足更多用途的需要。
The amide imide compared with poly pyromellitic diimide, softening point and heat deformation temperature lower, higher water absorption, the relative dielectric constant and dielectric loss angle tangent. Future development direction is to enhance the modification, alloying with other plastics, to improve the bad performance, to meet the need for additional purposes.